“When it comes to winning, you need the skill and the will.” - Frank Tyger. This blog is an initiative idea to provide the skill and will to win.
Saturday, October 18, 2014
master reset code for all samsung mobile phones
master reset code for all samsung phones
this will delete all your data off your phone
this is the code *2767*3855#
Water or liquid Damaged phone: Whats to do? How to recover phone? What i...
What you should do if your phone drops in water?
And how to recover phone?
What is physics underneath it?
One question that asked several times to me is that what's to do, when phone drop in water, tea, coffee or something similar or these things are poured onto the phone. Is this damage yours phone? You will shock to know that, water is a main component used in fabrication of these phones and its tiny components and ICs. So why these phone, damages with water? And, how will you recovered damaged phones?
In this video I will show you how the water damages the component on the board. And why Samsung is more resistive to this damage. The IC's on Samsung phone are sealed. And there is less probability of entering water underneath the IC. The BGA ICs are more sensitive to water. You will shock to know that these IC are cleaned with water before packaging. So why water create problem here. The problem is created by water itself. During fabrication De ionised water is taken whose conductivity is very low. But the water that we use in our home has sufficient conductivity. And when it stuck under these IC's, the BGA connects are shorted. This will damage the IC or the component attached to these IC's. In worse condition the water underneath boils due to power voltage across the BGA balls. And that expansion torn the IC's pin-outs from the board. So only drying the board, completed the recovery process. You have to take out all of the water underneath the ICs. This can't be done, either by putting phone in Rice or Tea, or by compressed air. Now there is one catch here, dry the board in your hand this will limit the temperature. Because excessive heat boils the water underneath the IC and thus create a pressure underneath IC, this will, either break IC or torn the contact pads on PCB. So go slowly.
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